High Cooling Power Density of SiGe/Si Superlattice Microcoolers

Abstract

Fabrication and characterization of SiGe/Si superlattice microcoolers integrated with thin film resistors are described. Superlattice structures were used to enhance the device performance by reducing the thermal conductivity, and by providing selective emission of hot carriers through thermionic emission. Thin film metal resistors were integrated on top of the cooler devices and they were used as heat load for cooling power density measurement. Various device sizes were characterized. Net cooling over 4.1 K and a cooling power density of 598 W/cm2 for 40 x 40 mm2 devices were measured at room temperature.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2006
Accession Number
ADA458764

Entities

People

  • Ali Shakeouri
  • Chris Labounty
  • Daryoosh Vashaee
  • Edward Croke
  • Gehong Zeng
  • James Christofferson
  • John E. Bowers
  • Xiaofeng Fan
  • Yan Zhang

Organizations

  • HRL Laboratories

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Abstracts
  • Crystal Lattices
  • Electrical Resistance
  • Engineering
  • Fabrication
  • Figure Of Merit
  • Film Resistors
  • Films
  • Heat Energy
  • Heat Sinks
  • Metals
  • Resistance
  • Substrates
  • Superlattices
  • Thermal Conductivity
  • Thermal Resistance
  • Thin Films

Fields of Study

  • Materials science

Readers

  • Combustion and Flow Dynamics.
  • Pulsed Power and Plasma Physics.
  • Thin Film Deposition Science.