AC Coupled Interconnect for Low Power Spaceborne Electronics

Abstract

The primary objective of this effort was to establish that AC Coupled Interconnect could be used to create multiple solutions to contactless chip-to-chip communications. Towards this goal, we took an experimental approach, developing and conducting a set of experiments showing this can be successfully achieved. In this final report, we summarize the outcomes of those experiments and list the papers, graduate students and technology transfer outcomes of this activity.

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Document Details

Document Type
Technical Report
Publication Date
Sep 30, 2006
Accession Number
ADA462801

Entities

People

  • Paul D Franzon

Organizations

  • North Carolina State University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force Research Laboratories
  • Bandwidth
  • Circuits
  • Connectors
  • Couplings
  • Data Rate
  • Demonstrations
  • Diagrams
  • Electronics
  • Flip Chips
  • Frequency
  • High Density
  • Laminates
  • Packaging
  • Spaceborne
  • Technology Transfer
  • Three Dimensional

Readers

  • Computational Modeling and Simulation
  • Integrated Circuit Design and Technology.
  • Technical Research and Report Writing.

Technology Areas

  • Microelectronics