Fabrication of a Fully Integrated Passive Module for Filter Application Using MCM-D Compatible Processes

Abstract

Integral passive is an emerging technology which is currently perceived as a possible alternative to the discrete passive technology in fulfilling the next generation packaging needs. Although discrete surface mount passive components (resistors, capacitors, and inductors) have been well characterized, the development of integral passive components suitable for co-integration on the board level is relatively recent. Since in some applications the number of passive components can exceed the number and the area of tC chips on a circuit board or in a package, such integration of passive components would be necessary to substantially eliminate part count and reduce device area. To address these issues, integration technology for passive elements in the same manner as for transistors is necessary. In addition, the fabrication sequence of all integral passive components should be mutually compatible for co-integration on the same substrate. In this paper, materials and fabrication issues for passive elements such as resistors (R), capacitors (C), and inductors (l) and the feasibility of integration of these fabricated passive components on glass substrates have been addressed. An active filter circuit has been selected for a case study for R, L, and C cointegration. This passive module contains eleven resistors, four capacitors, and four inductors, and is fabricated using MCM-D (multichip module-deposited) compatible processes. A variety of materials appropriate for fabrication of integral passives in a mutually compatible fashion were investigated, including chromium and nickel-chromium resistors, composites of high dielectric constant materials in epoxies for capacitor dielectrics, and composites of magnetic ferrite particles in polyimides for inductor core and shielding.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2000
Accession Number
ADA465718

Entities

People

  • Jae Y. Park
  • Mark G. Allen
  • Rag R. Tummala
  • Swapan K. Bhattacharya

Organizations

  • Georgia Tech

Tags

DTIC Thesaurus Topics

  • Capacitance
  • Composite Materials
  • Dielectric Permittivity
  • Dielectrics
  • Epoxy Composites
  • Fabrication
  • Ferrites
  • Films
  • Frequency
  • High Temperature
  • Low Temperature
  • Magnetic Materials
  • Mass Production
  • Materials
  • Materials Processing
  • Materials Science
  • Thin Films

Readers

  • Integrated Circuit Design and Technology.
  • Microwave Engineering.