Characterization of a Silicon-Micromachined Thermal Shear-Stress Sensor

Abstract

A detailed characterization is presented of a silicon-micromachined thermal shear-stress sensor employing a thin-film platinum-sensing element on top of a silicon-nitride membrane that is stretched over a vacuum cavity. The sensor was operated in a constant current mode and characterized using a four-point probe configuration to isolate the sensor response from the effects of external compensation circuitry. The characterization results consist of static sensitivity data at multiple overheat ratios (maximum of 11 mV/Pa at an overheat of 1.0), pressure sensitivity spectra (<1 microvolt/Pa), noise floor spectra (100 nV/square root of Hz), and direct dynamic calibration data (up to 7 kHz). Noise floor measurements reveal a minimum detectable shear stress of 9 microPa/Hz, thus resulting in a sensor dynamic range of over 100 dB (9 microPa 1.7 Pa).

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 2002
Accession Number
ADA466321

Entities

People

  • Anthony Cain
  • Louis N Cattafesta
  • Mark Sheplak
  • Toshikazu Nishida
  • Venkataraman Chandrasekaran

Organizations

  • University of Florida

Tags

Communities of Interest

  • Sensors

DTIC Thesaurus Topics

  • Air Force
  • Boundary Layer
  • Ceramic Materials
  • Dynamic Response
  • Engineering
  • Engineers
  • Fluid Flow
  • Fluid Mechanics
  • Frequency Response
  • Heat Transfer
  • Materials Science
  • Measurement
  • Mechanical Engineering
  • Mechanics
  • Shear Stresses
  • Thin Films
  • Turbulent Flow

Readers

  • Acoustics.
  • Integrated Circuit Design and Technology.
  • Mechanical Engineering/Mechanics of Materials.