Flip Chip Hybridization Using Indium Bump Technology at ARL
Abstract
Flip chip hybridization bonding is a microelectronics packaging technique which directly connects an active device to a substrate face down, eliminating the need for peripheral wirebonds. Solder material is used as the conductive link between the two parts. Soldier bumps are directly deposited onto the active regions of the device and substrate. The main type of solder bump used at the Army Research Laboratory is the indium solder bump. Indium bump technology has been a part of the electronic interconnect process field for many years. This report discusses the techniques of flip chip hybrid bonding using indium bumps.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 01, 2007
- Accession Number
- ADA470149
Entities
People
- Kimberley A. Olver
Organizations
- United States Army Research Laboratory