Modeling Microfabricated Multipoint Fuze Initiators Part 1: Pre-Melting Behavior

Abstract

Future combat systems require warheads with multi-point initiators to produce precise simultaneous detonations. Semiconductor fabrication methods, combined with MEMS-enabling process technologies at ARL, enable geometrically accurate conductors bridge wire for such multipoint initiators. To understand how our device design, material deposition, and post processing influence bridge wire performance and ultimately simultaneity, we have simulated the behavior of an exploding metal bridge. In this report we present results focusing on the thermalelectric problem of heating up to the bridge wire melting point. The results in terms of time for the center of the exploding foil to reach the material melting temperature was within 2% of a similar, published modeling study, and approximately within 20% of the experimentally observed time-to-burst for specific geometries fabricated at ARL. We also performed a sensitivity study and found the melting time to be most sensitive to bridge wire thickness, and all material properties except thermal conductivity. Simple, analytical arguments explain these results. Finally, we detail a path forward to eventually result in a predictive model allowing direct comparison between model outputs and experimental data. Such a model will greatly enhance our ability to design better bridge wire devices.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2008
Accession Number
ADA476853

Entities

People

  • Brian Mary
  • Christopher J. Morris
  • Edward Shaffer
  • Eugene S. Zakar
  • Madan Dubey
  • Paul Amirtharaj

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics
  • C4I

DTIC Thesaurus Topics

  • Conductivity
  • Current Density
  • Equations
  • Experimental Data
  • Explosives
  • Explosives Initiators
  • Fabrication
  • Fluid Mechanics
  • Geometry
  • Heat Energy
  • Heat Of Fusion
  • Heat Transfer
  • Materials
  • Melting Point
  • Thermal Conductivity
  • Thickness
  • Two Dimensional

Readers

  • Computational Modeling and Simulation
  • Electrical Engineering
  • Materials Science and Engineering.

Technology Areas

  • Microelectronics