Thermal Simulation of Four Die-Attach Materials

Abstract

We performed a time-dependent simulation of thermal transfer in a circuit board, comparing the effects of using four different die-attach materials with high-power silicon carbide diodes. This simulation attempted to reproduce the results of a laboratory experiment in which thermal measurements were made of circuit boards under a time-varying load.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2008
Accession Number
ADA477372

Entities

People

  • Gregory K. Ovrebo

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Carbides
  • Ceramic Materials
  • Circuit Boards
  • Compound Semiconductors
  • Conductivity
  • Electrical Conductivity
  • Electrical Properties
  • Elements
  • Heat Transfer
  • Materials
  • Physical Properties
  • Silicon
  • Silicon Carbide
  • Simulations
  • Surface Temperature
  • Thermal Conductivity
  • Thermal Resistance

Fields of Study

  • Physics

Readers

  • Computational Modeling and Simulation
  • Integrated Circuit Design and Technology.
  • Thermal Physics or Thermal Science.