Reliability of Next Generation Power Electronics Packaging Under Concurrent Vibration, Thermal and High Power Loads

Abstract

This final report presents a study on predicting reliability of next generation power electronics packaging, under high power loads. The study entails computational simulation modeling of power electronics packaging under high current density, high temperature gradient, high temperature and mechanical loads. Computer simulations are used for various scenarios to predict life time to failure and predictions are compared against actual experimental field data to validate the models.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 2008
Accession Number
ADA477466

Entities

People

  • Cemal Basaran

Organizations

  • State University of New York

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Computational Science
  • Creep
  • Crystal Structure
  • Elastic Properties
  • Failure Mode And Effect Analysis
  • Finite Element Analysis
  • Integrated Circuits
  • Material Degradation Processes
  • Materials
  • Materials Science
  • Mechanical Properties
  • Mechanics
  • Power Electronics
  • Stress Strain Relations
  • Temperature Gradients
  • Three Dimensional
  • Yield Strength

Fields of Study

  • Engineering
  • Physics

Readers

  • Computational Modeling and Simulation
  • Electrical Engineering
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems