Optoelectronic Circuits Using 2D and 3D Self-Collimation Photonic Crystals
Abstract
In our effort to develop and demonstrate the design, fabrication, and experimental characterization of self-collimation photonic crystal devices (SCPhCs) in both 2D and 3D structures, we identified various tasks and goals towards achieving the proposed applications. Two-dimensional self collimation photonic crystal structures will be used for in-plane optical signal distribution and routing while three-dimensional structures will be used for out-plane signal distribution, to provide high-density optically interconnected optoelectronic PhC circuits to distribute the optical signal between various circuits and in different angles. As previously proposed we intend to fabricate 2D structures using Ill-V materials and 3D structures using Silicon, and later use flip-chip bonding to construct our optoelectronic circuit. Hence, In this phase we develop and refine 111-V lithography and etching processes, including ebeam and UV interferometric lithography, ICP etching, and Oxidation followed by HF undercut. We will also develop suitable growth techniques to obtain GaAs/AlGaAs layered structures for suspended PhC Devices.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 01, 2007
- Accession Number
- ADA477786
Entities
People
- Dennis W. Prather
Organizations
- University of Delaware