Structurally Efficient Anisotropic Organized Reticulated structures for Cooling of Electronics and Sensors

Abstract

Anisotropic Organized Reticulated-Filament Structures (AORS), consisting of group- interconnected and purposely oriented thermally conductive filaments, can be configured to have wide ranging porosity and a large specific surface area. When deployed as heat exchanger matrices, these structures produce high ntu-values (number of transfer units) because of the large specific surface area inherent to the media. Examples of structures with the above described characteristics are: laminations of orthogonal-weave fine-wire screen, three-filament stacked weaves and box lattice structures. Box lattice structures offer increased design flexibility relative to woven structures since filament cross section shape (in addition to filament orientation) can be tailored to a specific application. Relative to a box lattice with circular cross section filaments, ellipticity adds surface area to the structure, as well as the possibility to streamline flow through the array. Furthermore, box lattices have superior strength characteristics. Research focuses on characterizing the geometric, thermal and structural attributes of box lattice structures. Geometric models of porosity and specific surface area are developed along with a thermal model of the effective of the effective thermal conductivity. They show that metal fraction can range as: 00/0 - 0.94%; dimensionless specific surface area can range as: 0.93- 3.14 and dimensionless effective thermal conductivity can range as: 0 - 0.78.

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Document Details

Document Type
Technical Report
Publication Date
Aug 31, 2006
Accession Number
ADA478696

Entities

People

  • Richard A. Wirtz
  • Yanyao Jiang

Organizations

  • University of Nevada, Reno

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies
  • Human Systems
  • Weapons Technologies

DTIC Thesaurus Topics

  • Aluminum Alloys
  • Boundary Layer
  • Computational Fluid Dynamics
  • Finite Element Analysis
  • Flow Visualization
  • Fluid Dynamics
  • Fluid Flow
  • Heat Transfer
  • Materials
  • Mechanical Engineering
  • Mechanical Properties
  • Mechanical Working
  • Mechanics
  • Stress Strain Relations
  • Thermal Conductivity
  • Three Dimensional
  • Turbulent Flow

Readers

  • Reinforced Composite Materials
  • Systems Analysis and Design
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics