Electro-Osmotic Pulse Technology: A Novel Solution to Severe Water Intrusion Problems in Earth Covered Magazines

Abstract

The earth covered magazines (ECMs) at many Army installations have severe moisture intrusion problems. This water intrusion causes deterioration and corrosion of ammunition and equipment within the ECMs, making many types of ordinance unusable, including sensitive munitions with sophisticated electronic fusing and missiles. The Engineer Research and Development Center Construction Engineering Laboratory (ERDC-CERL) was contacted by the Ft. A.P. Hill DPW to assist in solving the severe water intrusion problem in steel arch ECMs at that location. To address the problem ERDC-CERL recommended installing Electro- Osmotic Pulse (EOP). Prior to installing the EOP system in an ECM, several safety concerns needed to be addressed, such as the interaction of the EOP system with the ECM lightning protection system, the potential for hydrogen gas generation by the EOP system, and the effects on munitions. To evaluate those concerns, ERDC-CERL performed laboratory testing of a model steel arch ECM with an EOP system installed in it. Scale model results were positive and testing in a full scale ECM at Fort A.P. Hill is proceeding.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 2006
Accession Number
ADA481574

Entities

People

  • Michael K. McInerney
  • Orange S. Marshall Jr.
  • Sean Morefield
  • Vincent F. Hock

Organizations

  • Engineer Research and Development Center

Tags

Communities of Interest

  • Energy and Power Technologies
  • Materials and Manufacturing Processes
  • Weapons Technologies

DTIC Thesaurus Topics

  • Abstracts
  • Ammunition
  • Construction
  • Demographic Cohorts
  • Electric Fields
  • Engineering
  • Hydrogen
  • Lightning
  • Lightning Protection
  • Models
  • Moisture
  • Periodicals
  • Safety
  • Scale Models
  • Test And Evaluation
  • Voltage
  • Waveforms

Readers

  • Facility/Structural Engineering.
  • Geotechnical Engineering.
  • Sensor Fusion and Tracking Systems.

Technology Areas

  • Microelectronics