A Liquid Cooler Module with Carbon Foam for Electronics Cooling Applications (Preprint)

Abstract

A liquid cooler module (LCM) employing a high thermal-conductivity, pitch-based carbon foam is studied. The newly developed carbon foam has an effective conductivity up to 150 W/m-K and porosity up to 90%. It is believed that this high-conductivity carbon foam could significantly enhance the heat transfer due to the thermal dispersion effect. To prove the concept of the carbon foam liquid cooler, a three-dimensional numerical study of the carbon foam cooler was undertaken. The numerical results indicated that even with a heat flux as high as 100 W/cm2, the average temperature drop between the substrate and the liquid coolant is less than 20 degrees C. Experimental study was also undertaken for the LCM and the results were compared with the numerical results.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 2008
Accession Number
ADA484744

Entities

People

  • Rengasamy Ponnappan
  • Yiding Cao

Organizations

  • Air Force Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Air Force
  • Air Force Research Laboratories
  • Boundary Layer
  • Conductivity
  • Electronics
  • Equations
  • Experimental Data
  • Flow Rate
  • Fluid Flow
  • Heat Flux
  • Heat Transfer
  • Mass Flow
  • Materials
  • Numerical Analysis
  • Production Engineering
  • Substrates
  • Thermal Conductivity

Readers

  • Analytical Chemistry
  • Computational Fluid Dynamics (CFD)
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics