Novel Low-Melt Viscosity Polyimides for Resin Transfer Molding (RTM)

Abstract

A series of polyimide resins with low-melt viscosities in the range of 10-30 poise and high glass transition temperatures (Tg's) of 330-370 degrees C were developed for resin transfer molding (RTM) applications. These polyimide resins were formulated from 2,3,3' 4' - biphenyltetracarboxylic dianhydride (a-BPDA) with 4-phenylethynylphthalic anhydride endcaps along with either 3,4, -oxyaniline (3,4' - ODA), 3,4, -methylenedianiline, (3,4' -MDA) or 3,3, -methylenedianiline (3,3' -MDA). These polyimides had pot lives of 30-60 minutes at 260-280 degrees C, enabling the successful fabrication of T650-35 carbon fiber reinforced composites via RTM process. Mechanical properties including open hole compression and short beam shear data were collected at room temperature, 288 degrees C and 315 degrees C were determined. These new resin composites showed excellent retention of properties at 315 degrees C (600 degrees F).

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Document Details

Document Type
Technical Report
Publication Date
Aug 29, 2008
Accession Number
ADA486771

Entities

People

  • Eric A. Mintz

Organizations

  • Clark Atlanta University

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Anhydrides
  • Composite Material Fabrication
  • Composite Materials
  • Compression
  • Compressive Strength
  • Fabrication
  • Fiber Reinforced Composites
  • Fibers
  • Materials
  • Mechanical Properties
  • Moldings
  • Physical Properties
  • Polyimide Resins
  • Resin Transfer Molding
  • Rheology
  • Shear Strength
  • Viscosity

Fields of Study

  • Materials science

Readers

  • Polymer Science and Engineering.
  • Reinforced Composite Materials