Novel Low-Melt Viscosity Polyimides for Resin Transfer Molding (RTM)
Abstract
A series of polyimide resins with low-melt viscosities in the range of 10-30 poise and high glass transition temperatures (Tg's) of 330-370 degrees C were developed for resin transfer molding (RTM) applications. These polyimide resins were formulated from 2,3,3' 4' - biphenyltetracarboxylic dianhydride (a-BPDA) with 4-phenylethynylphthalic anhydride endcaps along with either 3,4, -oxyaniline (3,4' - ODA), 3,4, -methylenedianiline, (3,4' -MDA) or 3,3, -methylenedianiline (3,3' -MDA). These polyimides had pot lives of 30-60 minutes at 260-280 degrees C, enabling the successful fabrication of T650-35 carbon fiber reinforced composites via RTM process. Mechanical properties including open hole compression and short beam shear data were collected at room temperature, 288 degrees C and 315 degrees C were determined. These new resin composites showed excellent retention of properties at 315 degrees C (600 degrees F).
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 29, 2008
- Accession Number
- ADA486771
Entities
People
- Eric A. Mintz
Organizations
- Clark Atlanta University