Characterization of the Material Microstructure for Reactive Material Design. 3rd Quarterly Progress Report II/2008

Abstract

The report addresses the current status of the tasks "material testing", "structure generator" and "microstructural finite-element solver". Material tests were carried out for several samples (Cu, Fe, CuFe). Tensile tests, flyer plate impact tests and Taylor tests were conducted, where spallation and fragmentation occurred under relevant test conditions. Capturing and characterization of fragments has been achieved in some of these tests. A quantitative determination of the micro-structure of a FeCu sample was conducted and several methods were tested for the generation of geometry models and meshes. The methods applied also included commercial software. The microstructural FE solver, MICROFEM, has been equipped with interface elements, while the work on suitable tetrahedral elements still continues. In addition to the work on MICROFEM alternative concepts of simulation were explored. This includes LS DYNA simulations on the basis of structure models rendered on hexahedral grids. A physical model for a Cu sample has been calibrated to tensile test results and was used for simulations with impulsive loading.

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Document Details

Document Type
Technical Report
Publication Date
Aug 05, 2008
Accession Number
ADA486904

Entities

People

  • Arno Klomfass
  • Frank Bagusat
  • Konrad Linnemann
  • Martin Sauer
  • Martin Steinhauser
  • Sascha Knell

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Algorithms
  • Computational Fluid Dynamics
  • Dynamic Tests
  • Finite Element Analysis
  • Geometry
  • Impact Tests
  • Materials
  • Mechanical Properties
  • Mechanics
  • Microstructure
  • Pattern Recognition
  • Reactive Materials
  • Stress Strain Relations
  • Stresses
  • Tensile Stress
  • Three Dimensional
  • Two Dimensional

Fields of Study

  • Materials science

Readers

  • Aerospace Test and Evaluation
  • Computational Fluid Dynamics (CFD)
  • Superconducting Magnet Technology