Electron Multipactor: Theory Review, Comparison and Modeling of Mitigation Techniques in ICEPIC

Abstract

Mitigation approaches for single surface multipactor at dielectric windows are investigated using Particle-In-Cell (PIC) simulations. Initially baseline susceptibility diagrams are constructed analytically and compared with self-consistent, dynamic system trajectories. The power deposited on the surface of a dielectric window in an HPM system is considered using three different methods and the results of PIC simulations. Geometric mitigation is then considered by varying the window orientation with respect to the HPM electric held. Small angular deviations, less than 20 degrees, from the nominal case of normal incidence show dramatic changes in the susceptibility diagram. A materials approach to mitigation is then considered. Titanium Nitride, TiN, coatings applied to the dielectric surface can substantially reduce the secondary emission yield. Representative modifications of the secondary emission yield are simulated and the resulting susceptibility diagrams are discussed.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 2009
Accession Number
ADA495885

Entities

People

  • Neil C Rogers

Organizations

  • Air Force Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Air Force
  • Angle Of Incidence
  • Current Density
  • Department Of Defense
  • Electric Fields
  • Electron Density
  • Electron Emission
  • Electrons
  • Emission
  • Engineering
  • Equations Of Motion
  • Films
  • Geometry
  • Secondary Emission
  • Thin Films
  • Two Dimensional
  • United States Government

Fields of Study

  • Physics

Readers

  • Computational Modeling and Simulation
  • Pulsed Power and Plasma Physics.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics