Damping MEMS Devices in Harsh Environments Using Active Thin Films

Abstract

We report on fabrication and damping measurement of NiTi and Terfenol-D thin films. A model for prediction of the damping properties (tan delta) of a laminate using the material properties of the layers was developed. Damping properties in Nitinol thin film due only to residual stresses was measured to be as high as tan delta = 0.17 for large strain (0.9%). At lower strain levels a Nitinol/Silicon laminate was tested in a cantilever load frame. The damping value of the film was measured to be 0.28 (at 0.27% strain). A Nitinol/Terfenol-D/Nickel laminate was fabricated and tested in a cantilever loading. The damping value of the film was measured to be 0.2 (at 0.27% strain).

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Document Details

Document Type
Technical Report
Publication Date
Jun 17, 2008
Accession Number
ADA499154

Entities

People

  • Catherine A. Kerrigan
  • Gregory P. Carman

Organizations

  • University of California, Los Angeles

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Domain Walls
  • Engineered Materials
  • Engineering
  • Films
  • Frequency
  • Magnetic Properties
  • Magnetometers
  • Materials
  • Materials Processing
  • Materials Science
  • Measurement
  • Microelectromechanical Systems
  • Modulus Of Elasticity
  • Residual Stress
  • Stiffness
  • Students
  • Thin Films

Readers

  • Materials Science and Engineering.
  • Structural Dynamics.