Characterization of Hardening by Design Techniques on Commercial, Small Feature Sized Field-Programmable Gate Arrays

Abstract

This thesis experimentally tests and evaluates programmable logic devices under gamma irradiation to determine radiation effects and characterize improvements of various hardening by design techniques - Error Correction Coding(ECC) and Triple Modular Redundancy (TMR). The TMR circuit includes three different functional implementations of adders compared to TMR voted circuits of those same adders. The TMR is implemented with the same functional adders and as a Functional TMR (FTMR) with three different function adders that are voted on. These adders are connected to single voter TMR and FTMR circuits to evaluate the improvements. The circuit is designed to check for errors in memory data, stuck bit values in the memory, and the performance improvements that ECC provides the system. The results show that TMR or FTMR circuits failed at a rate at or above the single copy adders. This results from the single point of failure created by the voting logic in the radiation environment. When the TMR or FTMR circuit is moved off-chip, the TMR single point of failure is removed and the results demonstrate much lower SEU error rates.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 2009
Accession Number
ADA500601

Entities

People

  • Thomas E. Simmons

Organizations

  • Air Force Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Application-Specific Integrated Circuits
  • Coding
  • Complementary Metal-Oxide Semiconductors
  • Computer Programming
  • Computers
  • Dose Rate
  • Electromagnetic Radiation
  • Electronics
  • Field Programmable Gate Arrays
  • Gamma Rays
  • Integrated Circuits
  • Intellectual Property
  • Ionizing Radiation
  • Radiation Effects
  • Semiconductors
  • Simulations

Readers

  • Computer Programming and Software Development.
  • Integrated Circuit Design and Technology.
  • Manufacturing Engineering.