The Artificial Eye: A Focal Plane Detector/Read-Out IC Imaging Array Fabrication on Interior Spherical Surfaces

Abstract

Formation of high performance organic electronic devices on three dimensionally deformed surfaces is severely constrained by the tensile stresses and shear that are introduced during the deformation process. Here, we overcome these limitations to demonstrate the direct transfer of unstrained metals via cold welding onto preformed, 1.0 cm radius plastic hemispheres with micrometer scale feature resolutions to realize 10 kilopixel organic photodetector focal plane arrays (FPAs) that mimic the size, function, and architecture of the human eye. The passive matrix FPA consists of (40microns)2 organic double heterojunction photodetectors with response extending across the visible spectrum. The detector dark current density is 5.3+/-0.2 microA/sq 2 at -IV bias, and with a peak external quantum efficiency of 12.6+/-0.3% at a wavelength of 640nm. The photodetector impulse response was 20+/-2 ns. making the FPA suitable for video recording applications. The measured dynamic range allows for 7 bit image resolution, and the FPA is used to create a simple image. This demonstration significantly extends the ability to transfer active electronic devices that has previously only been demonstrated on planar substrates.

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Document Details

Document Type
Technical Report
Publication Date
Aug 07, 2008
Accession Number
ADA503855

Entities

People

  • Stephen R. Forrest

Organizations

  • University of Michigan

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms

DTIC Thesaurus Topics

  • Arrays
  • Cold Welding
  • Current Density
  • Department Of Defense
  • Detectors
  • Dynamic Range
  • Efficiency
  • Fabrication
  • Films
  • Focal Plane Arrays
  • Focal Planes
  • Organic Electronic Devices
  • Photodetectors
  • Prostheses And Implants
  • Quantum Efficiency
  • Semiconductors
  • Three Dimensional

Fields of Study

  • Physics

Readers

  • Image Processing and Computer Vision.
  • Integrated Circuit Design and Technology.
  • Quantum Dot Semiconductor Device Photonics and Graphene Optoelectronic Materials and THz Physics.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems
  • Quantum Computing