Direct Fabrication of a-Si:H Thin Film Transistor Arrays on Plastic and Metal Foils for Flexible Displays

Abstract

In this paper we describe solutions to address critical challenges in direct fabrication of amorphous silicon thin film transistor (TFTs) arrays for high information content active matrix flexible displays for Army applications. For all flexible substrates a manufacturable handling protocol in automated display-scale equipment is required. For metal foil substrates the principal challenges are planarization and electrical isolation, and management of coefficient of thermal expansion induced stress (CTE mismatch) during TFT fabrication. For plastic substrates the principal challenge is dimensional instability management.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 2008
Accession Number
ADA505769

Entities

People

  • B. P. O'brien
  • C. Moyer
  • D. Bottesch
  • D. C. Morton
  • D. E. Loy
  • David R. Allee
  • E. J. Bawolek
  • E. W. Forsythe
  • G. B. Raupp
  • J. Dailey
  • J. Haq
  • J. P. Kaminski
  • M. Marrs
  • N. Colaneri
  • R. Naujokaitis
  • S. K. Ageno
  • S. M. O'rourke
  • S. M. Venugopal

Organizations

  • Arizona State University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Abstracts
  • Chemical Vapor Deposition
  • Electronics
  • Fabrication
  • Films
  • Intellectual Property
  • Manufacturing
  • Materials
  • Modules (Electronics)
  • Processing Equipment
  • Roughness
  • Substrates
  • Surface Properties
  • Surface Roughness
  • Thin Film Transistors
  • Thin Films
  • Transistors

Readers

  • Nanofabrication and Microfabrication.
  • Software Engineering
  • Thin Film Deposition Science.