Toward Three Dimensional Circuits Formed by Molten-Alloy Driven Self-Assembly

Abstract

Self-assembly opens new possibilities in three-dimensional (3-D) device structures, and here we report on our progress toward a self-assembling 3-D circuit. A major challenge to such a system has been the fabrication of large numbers of free-standing, microfabricated parts, and we have overcome this challenge by developing a new wafer-bond and release process. We present this process on 100 mm diameter wafers, and finally show initial assembly results.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 2008
Accession Number
ADA505770

Entities

People

  • Christopher J. Morris
  • Madan Dubey

Organizations

  • United States Army Research Laboratory

Tags

DTIC Thesaurus Topics

  • Abstracts
  • Assembly
  • Circuits
  • Crystals
  • Electrical Resistance
  • Fabrication
  • Geometry
  • Integrated Circuits
  • Manufacturing
  • Materials
  • Mathematics
  • Microelectromechanical Systems
  • Polymers
  • Resistance
  • Self Assembly
  • Semiconductors
  • Three Dimensional

Readers

  • Nanofabrication and Microfabrication.
  • Quantum Dot Semiconductor Device Photonics and Graphene Optoelectronic Materials and THz Physics.