Current Capacity of Carbon Nanofiber Interconnects
Abstract
Carbon nanofibers are promising interconnect materials for future military applications. How they behave in the elevated ambient temperature environment of a battle field is studied by performing series of current-induced nanofiber breakdown experiments. In a battlefield, the ambient temperature of electronic equipment is often raised significantly due to use of ammunition, explosion, and/or fire, but integrated circuits (IC) or chips embedded in the equipment should never malfunction. Interconnects are one of the most critical heat-generating elements on a chip, and their operation must be optimized in the context of the interplay between electrical and thermal transport, especially for military applications.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 01, 2008
- Accession Number
- ADA506111
Entities
People
- Cary Y. Yang
- Patrick Wilhite
- Toshishige Yamada
- William Bet-sayad
Organizations
- Santa Clara University