Synthesis of Polyimides Produced from Novel High Temperature Polyhedral Oligomeric Silsesquioxane Dianilines
Abstract
Polyimides (PIs) are used extensively in a variety of applications such as circuit-printing films and semiconductor coatings in the microelectronics industry, spacecraft materials including solar arrays, thermal insulation blankets, and space inflatable structures, and in components in modern aircraft. PIs are well known for their thermal stability but are prone to long-term oxidative degradation and are notorious for having hydrothermal issues, especially when used in fiber-reinforced composites. A potential approach to mitigating these shortcomings is nanoscale reinforcement. In previous work, we have demonstrated protection of PIs in the low earth orbit environment through chemical bonding of a host of polyhedral oligomeric silsesquioxanes (POSS) into polyimide backbones by copolymerization through amine groups located in the POSS organic periphery. We have recently synthesized a novel high temperature POSS diamine that exhibits a strictly aromatic periphery that when copolymerized into the backbone of a growing polyimide enables the POSS molecule to assume a pendant-type conformation. We report an initial assessment of the resultant properties offering a glimpse of the potential benefits realized from the use of the monomer in applications demanding performance in challenging environments.
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 26, 2009
- Accession Number
- ADA506278
Entities
People
- Gregory R. Yandek
- Joseph M Mabry
- Timothy S. Haddad
- Vandana Vij
Organizations
- Air Force Research Laboratory