High Mobility 4H-SiC Trenched Gate MOSFETs
Abstract
A new 4H-SiC trenched gate MOSFET structure with epitaxial buried channel improving the channel mobility is reported. Fabricated devices subject to rapid thermal annealing at 850 deg C for 5 min exhibit a peak field-effect mobility of 104 cm(2)/Vs at room temperature (25 deg C) and a high peak of 269 cm(2)/Vs at 200 deg C, which are among the highest levels reported to date.
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 09, 2006
- Accession Number
- ADA507271
Entities
People
- J. H. Zhao
- Jian Wu
- Jinyin Hu
- T. Burke
- Xiangchong Li
- Xufeng Wang
Organizations
- United States Army Research, Development and Engineering Command