Flip Chip Bonding of 68 x 68 MWIR LED Arrays

Abstract

The flip chip bonding process is optimized by varying the bonding pressure, temperature, and time. The 68 68 mid wave infrared (MWIR) LED array was hybridized onto Si-CMOS driver array with same number of pixels. Each pixel has two indium bumps, one for cathode and another for anode. Both LED array and CMOS drivers have 15- m-square Indium bump contact pads. We used Karl Suss FC150 flip chip machine for bonding of CMOS driver array onto LED array. From the LED current-voltage characteristics, it is concluded that the optimized flip chip bonding process results in uniform contact and very low contact resistance. Both electrical and optical characteristics of LED array after flip chip bonding are presented.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2009
Accession Number
ADA510369

Entities

People

  • E. J. Koerperick
  • Fouad Kiamilev
  • J. P. Prineas
  • J. T. Olesberg
  • Kimberley A. Olver
  • L. M. Murray
  • Monica Taysing-lara
  • Naresh C. Das
  • Tom F. Boggess

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Arrays
  • Band Structures
  • Cameras
  • Chemical Vapor Deposition
  • Complementary Metal-Oxide Semiconductors
  • Detectors
  • Electrical Engineering
  • Electrical Properties
  • Electronic Mail
  • Electronics
  • Flip Chips
  • Light Sources
  • Manufacturing
  • Materials
  • Microscopy
  • Modules (Electronics)
  • Semiconductors

Fields of Study

  • Engineering

Readers

  • Acoustical Oceanography.
  • Image Processing and Computer Vision.
  • Plasma Physics.