Dielectric Response of Structured Multilayered Polymer Films Fabricated by Forced Assembly

Abstract

The effect of introducing a multilayer microstructure on the dielectric properties of polymer materials is evaluated in 32- and 256-layer films with alternating polycarbonate PC and polyvinylidene-hexafluoropropylene (coPVDF) layers. The permittivity, dielectric loss, dielectric strength, and energy density were measured as a function of the relative PC/coPVDF volume concentrations. The permittivity follows an effective medium model while the dielectric strength was typically higher than that predicted by a volume fraction based weighted average of the components. Energy densities as high as ~14 J /cm3, about 60% greater than that of the component polymers, are measured for 50% PC/50% coPVDF films.

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Document Details

Document Type
Technical Report
Publication Date
Mar 17, 2008
Accession Number
ADA512957

Entities

People

  • Alan Wan
  • Anne Hiltner
  • Eric Baer
  • James S. Shirk
  • Lionel Flandin
  • Mason A. Wolak
  • Matt Mackey
  • Ming-jen Pan

Organizations

  • United States Naval Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Assembly
  • Capacitance
  • Capacitors
  • Dielectric Properties
  • Dielectric Strength
  • Dielectrics
  • Electron Microscopy
  • Energy
  • Energy Storage
  • Films
  • Hybrid Power
  • Macromolecules
  • Materials
  • Polymeric Films
  • Polymers
  • Scanning Electron Microscopy
  • Thickness

Fields of Study

  • Physics

Readers

  • Computational Modeling and Simulation
  • Materials Science (Mechanical Engineering).
  • Nanofabrication and Microfabrication.