Ultrafast Integrated Optical Signal Processing

Abstract

We investigated the fabrication and optical characterization of photonic integrated circuit (PIC) designed for telecommunication applications using ultrafast (> 100Gbits/s) optical logic. The basic components in the PIC are active components, such as semiconductor optical amplifiers (SOAs), integrated with passive, light-routing waveguides and beam splitter/combiners. Optical switching is accomplished with SOAs embedded within the arms of Mach-Zehnder interferometers (MZIs), whereas power splitting/combining of propagating signals is carried out within multimode interferometers (MMIs). Figure 1 shows a schematic of the basic unit cell under investigation.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Jan 28, 2010
Accession Number
ADA514107

Entities

People

  • Erich P. Ippen
  • Leslie A. Kolodziejski

Organizations

  • Massachusetts Institute of Technology

Tags

DTIC Thesaurus Topics

  • Amplifiers
  • Chemical Vapor Deposition
  • Circuits
  • Department Of Defense
  • Electron Microscopes
  • Electroplating
  • Energy Bands
  • Fabrication
  • Integrated Circuits
  • Manufacturing
  • Materials
  • Metal Contacts
  • Photonic Integrated Circuits
  • Quantum Dot Lasers
  • Quantum Dots
  • Semiconductors
  • Waveguides

Fields of Study

  • Physics

Readers

  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics