Shelf-Stable Adhesive for Reduction of Composite Repair Hazardous Waste
Abstract
The objective of this one year duration, risk reduction/proof-of-concept preliminary program in response to SERDP SON WPSON-07-02 was to demonstrate the feasibility of producing an extended shelf-life and environmentally-compliant epoxy-based composite repair material that can be engineered into films, resin pastes and liquid shim adhesives. The key elements of this innovative technology demonstrated in this effort include the following: (1) Lower temperature (200 deg F or 93 deg C) curing for a Henkel Loctite adhesive system, (2) Extended room temperature shelf life of one part epoxy film adhesive systems using our encapsulation technology, (3) Equivalent mechanical properties to standard adhesive products, and (4) Significant Cost and Waste Reduction.
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 01, 2008
- Accession Number
- ADA520645
Entities
People
- Heather Kauth
- John Player
- Lebzy Gonzalez
- Robert Kovar
Organizations
- Infoscitex Corporation