Architecture Analysis of High Performance Capacitors (POSTPRINT)

Abstract

Evolutionary increases in the demand on electrical power systems have resulted in the need to develop the next generation of compact, power dense, electrical systems utilizing robust and efficient high voltage power devices that are operable over an extended temperature range (-55 degrees C to 250 degrees C). In particular, there is a need to investigate novel capacitive architectures as a means to compliment recent advances in SiC power devices and high temperature magnetic and insulation materials. These advanced electrical components have enabled the demonstration of compact, high switch rate power system components that can operate at temperatures in excess of 200 degrees C, but have been limited by current capacitor technology. Of concern with present state of the art capacitors are their volumetric energy density, dissipation factor, thermal stability, parasitic inductance, and failure mechanisms. A modeling and simulation capability will be described herein, which was used to investigate device architecture-electrical performance relationships for wound, collapsed, and stacked devices. Initially, a mathematical model is developed and utilized for both equivalent capacitor circuit analysis and device architecture field analysis, which were then used to identify factors (e.g., electrode, dielectric, contacts, etc.) that affect ESR, ESL, and capacitance. Additionally, finite element analysis of selected device architectures was accomplished to compare magnetic fields and thermal profiles predicted. The predicted electrical properties resulting from these analyses were then utilized as SPICE simulation input parameters to evaluate the performance of the different capacitors in a dc-dc boost converter model. Finally, modeling and simulation results are compared to empirical data sheet information and experimental data.

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 2009
Accession Number
ADA520883

Entities

People

  • Biswajit Ray
  • Hiroyuki Kosai
  • James Scofield
  • Jeffrey Stricker
  • Jennifer Decerbo
  • Navjot Brar
  • Seana Mcneal
  • Tyler Bixel

Organizations

  • Air Force Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Advanced Materials
  • Air Force
  • Air Force Research Laboratories
  • Capacitors
  • Converters
  • Dielectric Films
  • Dielectrics
  • Elements
  • Films
  • Finite Element Analysis
  • Flux Density
  • Geometry
  • High Temperature
  • Materials
  • Power Electronics
  • Thermal Conductivity
  • Voltage

Fields of Study

  • Engineering

Readers

  • Computational Modeling and Simulation
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems