Thermal-Electrical FEA of Localized Heating for MEMS Packaging

Abstract

Localized silicon fusion and eutectic bonding for MEMS packaging have been preliminarily investigated through the U.S. Army SBIR Phase I program entitled "Multi- Power Source for MEMS Packaging", contract #: W56HZV-05-C-0092. This methodology allows localized heating at the bonding area without overheating the temperature-sensitive MEMS device. This paper presents the newly developed three-dimensional finite element analysis (FEA) of localized heating for MEMS packaging, for analysis of the electrical problem, thermal problem, and the coupling between the two problems. It was confirmed that high temperature is confined and controllable in the heater-on-circuit localized heating technology.

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Document Details

Document Type
Technical Report
Publication Date
Nov 27, 2006
Accession Number
ADA521357

Entities

People

  • C. L. Xie
  • G. Newaz
  • J. R. Mabesa Jr.
  • M. Hailat

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Abstracts
  • Conductivity
  • Electrical Insulation
  • Electronics
  • Fabrication
  • High Temperature
  • Insulation
  • Isotherms
  • Materials
  • Mechanical Components
  • Microelectromechanical Systems
  • Microelectronics
  • Packaging
  • Physical Properties
  • Semiconductor Devices
  • Silicon Dioxide
  • Three Dimensional

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Plasma Physics / Magnetohydrodynamics
  • Software Engineering