Microstructural Response of Pure Copper to Cryogenic Rolling (PREPRINT)

Abstract

A high-resolution electron-back-scatter-diffraction (EBSD) technique was applied to quantify grain-structure development and texture evolution during/after cryogenic rolling of pure copper. Microstructure evolution was found to be a complex process involving mainly geometrical effects associated with strain and discontinuous recrystallization but also including limited twinning and grain subdivision. Recrystallization was deduced to be static in nature and probably occurred during static storage of the material at room temperature after cryogenic rolling. The texture contained a pronounced {110}<112> brass component; this observation was interpreted in terms of the suppression of cross slip at cryogenic temperatures. In general, cryogenic rolling was found to be ineffective for the formation of a nanocrystalline (NC) structure in pure copper.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 2010
Accession Number
ADA523570

Entities

People

  • A. Korznikov
  • S. L. Semiatin
  • S. Mironov
  • T. Konkova

Organizations

  • Russian Academy of Sciences

Tags

DTIC Thesaurus Topics

  • Air Force
  • Air Force Research Laboratories
  • Crystal Structure
  • Diffraction
  • Electron Microscopes
  • Electron Microscopy
  • Electrons
  • Grain Boundaries
  • Grain Size
  • High Angles
  • High Resolution
  • Low Angles
  • Materials
  • Mechanical Properties
  • Microscopy
  • Microstructure
  • Tensile Strength

Fields of Study

  • Materials science

Readers

  • Powder metallurgy of Titanium alloys.

Technology Areas

  • Microelectronics