Thermally Robust Polymer Dielectric Systems for Air Force Wide-Temperature Power Electronics Applications

Abstract

Thermally stable, mechanically robust, compact capacitors are the technology driver for high performance power systems. The proximity of power electronics to heat sources demands that the thermal load for electronic system cooling be reduced or eliminated in the new generation aircraft power systems. While aerospace power conditioning capacitors typically use polycarbonate (PC) films in wound capacitors for operation in the -55 deg C to 125 deg C range, there is a current need for high temperature polymer film dielectrics with dielectric stability up to 350-deg C. As part of our program toward meeting the objective of dielectric stability and reliability in capacitor devices at temperatures as high as 350-deg C, we designed and evaluated high strength polymer films with high glass transition temperatures (375-450 deg C) as well as high thermal stabilities (470-520 deg C). Variable temperature dielectric properties of metallized thin films in the RT-350 deg C range are reported for high temperature polymer systems such as fluorinated polybenzoxazoles (6F-PBO) and a fluorenyl polyester incorporating a diamond-like hydrocarbon unit, known as FDAPE. A comparative dielectric evaluation of the state-of-the-art fluorenyl polyester film FPE, with a glass transition temperature of 330 deg C, has also been performed. The focus of the study is on wide temperature dielectric measurements of film capacitance, and dissipation factor as well as insulation resistance and the effects of thermal cycling on polymer dielectric stability. Possible correlations between the thermo-mechanical properties of the polymer films and their high temperature dielectric properties are examined, from the viewpoint of their electro-mechanical stability for long-term operation in wide-temperature power electronics applications.

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 2009
Accession Number
ADA525351

Entities

People

  • Jeffery T. Stricker
  • Jennifer N. Decerbo
  • Marlene D. Houtz
  • Narayanan Venkat
  • Thuy D. Dang
  • Victor K. Mcnier
  • Zongwu Bai

Organizations

  • Air Force Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Air Force
  • Dielectric Permittivity
  • Dielectric Properties
  • Dielectrics
  • Dissipation Factor
  • Electronics
  • Failure Mode And Effect Analysis
  • Films
  • Glass Transition Temperature
  • High Temperature
  • Materials
  • Mechanical Properties
  • Polymeric Films
  • Power Electronics
  • Test And Evaluation
  • Thin Films
  • Transition Temperature

Readers

  • Electrical Engineering
  • Polymer Science and Engineering.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Space