In-Situ Adhesive Bond Assessment
Abstract
This project considered the optimal application of ultrasonic guided waves (using sparse piezoelectric transducer arrays) for probing composite skin-to-spar adhesive joints used in aerospace structural design for various forms of defects such as delamination and poorly-cured adhesive. An important part of the project was developing compensation in assessment algorithms for changing temperature effects corresponding to normal aircraft operations (-40 degrees C to +60 degrees C). Specifically, three fundamental research areas were considered: (l) analytical modeling/experimental validation of wave propagation that accounts for temperature effects on the transducer piezo-mechanical properties over the flight temperature range listed above the transducer-structure interaction, and the structure wave dispersion properties; (2) further development of a Global-Local method to simulate the interaction of the guided waves with structural defects in isotropic and composite panels that takes advantage of the Semi-Analytical Finite Element (SAFE) approach for the "global" simulation that significantly reduces computational time; and (3) development of physics-based and data-based (using a two-step detection/classification procedure) algorithms for assessing the in-situ state of an adhesive bond.
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 01, 2010
- Accession Number
- ADA532868
Entities
People
- Ankit Srivastava
- Francesco Lanza Di Scalea
- Ivan Bartoli
- Michael D Todd
- Tim Fasel
Organizations
- University of California, San Diego