Power Mems Development

Abstract

This month in Task 1.1 we made changes to two masks (Metal 3 and Dielectric) to improve the performance of the circuit breaker. Both double-side-polished (DSP) and silicon-on-insulator (SOI) wafers were processed using the revised masks.

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Document Details

Document Type
Technical Report
Publication Date
Nov 30, 2010
Accession Number
ADA533712

Entities

People

  • Andrew Hanser
  • John Bumgarner

Organizations

  • SRI International

Tags

DTIC Thesaurus Topics

  • Abstracts
  • Circuit Breakers
  • Dc-To-Dc Converters
  • Dielectrics
  • Electrons
  • Films
  • Heat Sinks
  • High Voltage
  • Information Operations
  • Materials
  • Metals
  • Military Research
  • Physical Sciences
  • Switches
  • Thin Films
  • Voltage

Readers

  • Integrated Circuit Design and Technology.
  • Pavement Materials Engineering.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems