Hardware Trust Implications of 3-D Integration

Abstract

3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductive posts. Since the dies may be manufactured separately, 3-D circuit integration offers the option of enhancing a commodity processor with a variety of security functions. This paper examines the 3-D design approach and provides an analysis concluding that the commodity die system need not be independently trustworthy for the system of joined dies to provide certain trustworthy functions. In addition to describing the range of possible security enhancements (such as cryptographic services), we describe the ways in which multiple-die subsystems can depend on each other, and a set of processing abstractions and general design constraints with examples to address these dependencies.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 2010
Accession Number
ADA535073

Entities

People

  • Cynthia E. Irvine
  • Jonathan Valamehr
  • Michael Bilzor
  • Mohit Tiwari
  • Ryan Kastner
  • Ted Huffmire
  • Timothy E. Levin
  • Timothy Sherwood

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Air Platforms
  • Cyber

DTIC Thesaurus Topics

  • Bandwidth
  • Circuits
  • Commodities
  • Computer Programs
  • Computer Science
  • Computers
  • Cybersecurity
  • Denial Of Service Attack
  • Electrical Properties
  • Engineering
  • Fabrication
  • Integrated Circuits
  • Multiple Access
  • Operating Systems
  • Security
  • Standards
  • Three Dimensional

Readers

  • Cybersecurity.
  • Metallurgy
  • Software Engineering.