EMPFASIS: A Publication of the National Electronics Manufacturing Center of Excellence
Abstract
The EMPF recently characterized the reliability of surface mount RF components. The RF frequency band of interest was the X band (10.7 to 11.7GHz). A two pronged test for reliability of circuit card assemblies (CCA) was designed for both extreme thermal cycling and vibration. The rapid thermal cycling and extreme vibration testing simulates the total stress encountered by the assembly over the life of the product but accomplishes it in a relatively short period of time. In order to perform the reliability testing, a test vehicle consisting of a printed circuit board with test structures and components, was designed, fabricated, and assembled at the EMPF.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 2010
- Accession Number
- ADA539863
Entities
People
- Barry Thaler
- Paul Bratt