Power MEMS Development
Abstract
This month, we continued fabrication of the Version 3.1 switches on three glass wafers. The fabrication was unsuccessful due to delamination of the sacrificial polymer, which occurred during deposition of the oxynitride structure layer. To address this and other fabrication issues, we redesigned the switch layout that included larger anchor points, gusseted spring connections, switch variations with 2x and 3x increases in the electrostatic electrode size, and a new chip with bench-style circuit-breaker switches.
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 01, 2011
- Accession Number
- ADA542949
Entities
People
- Drew Hanser
- John Bumgarner
Organizations
- SRI International