Precast/Prestressed Concrete Experiments Performance on Non-Load Bearing Sandwich Wall Panels

Abstract

To comply with the energy efficiency and build green initiatives contained in the Energy Policy Act of 2005 and Energy Independence Security Act of 2007, the Anti-Terrorism and Force Protection (ATFP) requirements for building construction, and the "build-it faster and more economical" requirements of the Military Construction Transformation initiative, a research program has been conducted by AFRL and the Portland Cement Association (PCA) on the performance of insulated concrete wall panels. The purpose of the research is to determine if commercially available wall systems with excellent energy savings performance can provide ATFP for military and government facilities. This report presents the static performance of the wall systems subjected to pseudo-blast pressures. The results indicate that sandwich wall systems provide blast resistance over a large deformation range making these systems useful for ATFP applications. The responses of the panels were found to be sensitive to reinforcement type, shear ties used, and insulation.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2011
Accession Number
ADA545204

Entities

People

  • Aaron Saucier
  • Bryan T. Bewick
  • Clay J. Naito
  • Hani A. Salim
  • John M. Hoemann
  • Jonathon S. Shull
  • Michael I. Hammons

Organizations

  • Black & Veatch

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Air Force
  • Air Force Facilities
  • Air Force Research Laboratories
  • Blast Resistance
  • Carbon Fibers
  • Construction
  • Department Of Defense
  • Fabrication
  • Failure Mode And Effect Analysis
  • Governments
  • Materials Laboratories
  • Materials Processing
  • Materials Testing
  • Mechanical Working
  • Polystyrenes
  • Prestressed Concrete
  • Yield Strength

Readers

  • Energy Conservation and Renewable Energy Engineering.
  • Government and Public Administration Law.
  • Pavement Materials Engineering.

Technology Areas

  • Microelectronics