Microstructure Evolution during Friction Stir Welding of Mill-Annealed Ti-6Al-4V (Preprint)

Abstract

In this study, mill-annealed Ti-6Al-4V plates were successfully friction stir welded over a wide range of processing parameters using a tungsten - 1%La2O3 tool. Two K-type thermocouples embedded in the tool indicated that approximately 25 pct. of the heat generated during welding was transferred out of the workpiece and into the tool. The thermocouple data, combined with observations of the microstructure, indicated that the stir zone of all welds exceeded the β transus. The microstructure and texture of two representative welds made just above and high above the beta; transus were investigated with scanning electron microscopy and electron backscatter diffraction (EBSD). The beta phase orientations were reconstructed with a fully automated technique from the ascollected alpha phase data through knowledge of the Burgers orientation relationship. The results suggest that the fine betagrains in the stir zone are formed from the base material ahead of the advancing tool by dissolution of secondary and primary alpha phase and there is no further recrystallization.

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Document Details

Document Type
Technical Report
Publication Date
May 01, 2011
Accession Number
ADA550315

Entities

People

  • A. P. Reynolds
  • Adam L. Pilchak
  • H. Sahiner
  • J. C. Wiliams
  • Wenjing Tang

Organizations

  • Air Force Research Laboratory

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Air Force
  • Air Force Research Laboratories
  • Diffraction
  • Electron Microscopy
  • Friction Stir Welding
  • Grain Size
  • Heat Energy
  • Materials
  • Materials Science
  • Metals
  • Military Research
  • Observation
  • Orientation (Direction)
  • Phase Transformations
  • Scanning Electron Microscopy
  • Solid Solutions
  • Steady State

Fields of Study

  • Materials science

Readers

  • Distributed Systems and Data Platform Development
  • Metallurgy
  • Powder metallurgy of Titanium alloys.

Technology Areas

  • Microelectronics