Thermo-Mechanical Properties of Alumina Films Created Using the Atomic Layer Deposition Technique

Abstract

Interdigitated humidity sensors with atomic layer deposited (ALD) coatings of aluminum oxide demonstrated no leakage current relative to uncoated sensors stored in the ambient, indicating Al2O3 may be used to limit the effects of H2O and other chemical species in miniaturized mechanical- and electronicdevices. The long term durability of such coatings is not known, but may be predicted from the related material characteristics. The modulus and hardness of Al2O3 were therefore measured by nanoindentation using a Berkovich tip. Because the coatings are brittle and possess a significant tensile stress, the influence of film stress on the indentation measurements was quantified using a numerical analysis protocol which also considered the effect of substrate compliance. The film stress and coefficient of thermal expansion for Al2O3 were determined using the wafer curvature method. Film stress was characterized using thermal cycling up to 500 ◦C. Separate Si/SiO2/Si microcantilever arrays demonstrated a stress variation according to the thickness of Al2O3 coatings. Fracture toughness was examined by indentation with a cube-corner tip; the estimates are subject to film stress and the material-dependent geometry factor.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2010
Accession Number
ADA552772

Entities

People

  • Arthur S. Morris
  • David C. Miller
  • Jacob A. Bertrand
  • Martin L. Dunn
  • Ross R. Foster
  • Shawn J. Cunningham
  • Shih-hui Jen
  • Steven M. George
  • Yung-cheng Lee

Organizations

  • University of Colorado Boulder

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Aluminum Oxides
  • Chemistry
  • Composite Materials
  • Geometry
  • Material Degradation Processes
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Measurement
  • Mechanical Properties
  • Mechanics
  • Microelectromechanical Systems
  • Modulus Of Elasticity
  • Numerical Analysis
  • Tensile Stress

Fields of Study

  • Materials science

Readers

  • Materials Science (Mechanical Engineering).
  • Structural Health Monitoring of Composite Structures.
  • Thin Film Deposition Science.