Efficient Thermal Dissipation Media for High Power Electronic Chip Packaging using CNT-Metal Based Composite
Abstract
Vertically aligned carbon nanotube (VA-CNT) films were synthesized and a method was developed to transfer the films from a Si to a Cu substrate. The diameters of the CNTs and the thickness of the films were 10-30 nm and 10-30 microns, respectively. LED packages made with VA-CNTs films were tested on an InGaN LED chip. The VA-CNTs film maintained a linear relationship of output light power without reaching saturation for the LED chip of 0.5 W InGaN. The VA-CNTs film greatly increased the input LED current, about more than 500 mA and 350 mA, respectively. A homogeneous distribution of multi-wall MWCNTs in a copper matrix was achieved by a novel processing approach based on the precursor method for synthesis of copper and acid-treated MWCNTs. Dispersion of the CNTs in Cu matrix is important and even determined nanocomposite material properties, such as to enhance the mechanical behavior and wear resistance of the Cu/CNTs. Successful functionalization of the nanotubes with mixture of acid solution may open new applications in composites field. Hardness and wear resistance of fabricated Cu/CNTs nanocomposites increased with increasing the mass fraction of CNTs.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 30, 2011
- Accession Number
- ADA554165
Entities
People
- Phan Ngoc Minh
Organizations
- Vietnam Academy of Science and Technology