AC Coupled Interconnect for Low Power Spaceborne Electronics

Abstract

The goal of this project was to provide a demonstration of issues related to laminate packaging, and demonstration of a socket system and a connector system using inductively and capacitively coupled AC interconnect. In addition, we were tasked to deliver a test module for a test in near earth orbit on the TacSat-3 spacecraft. The vast majority of the goals of the project were achieved.

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Document Details

Document Type
Technical Report
Publication Date
Jan 18, 2012
Accession Number
ADA554302

Entities

People

  • Paul D Franzon
  • Steve Lipa

Organizations

  • North Carolina State University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Air Force Research Laboratories
  • Circuit Boards
  • Complementary Metal-Oxide Semiconductors
  • Connectors
  • Dielectrics
  • Electromagnetic Fields
  • Electronics
  • Fabrication
  • Field Programmable Gate Arrays
  • Materials
  • Materials Science
  • Printed Circuit Boards
  • Printed Circuits
  • Semiconductors
  • Spacecraft
  • Three Dimensional

Fields of Study

  • Physics

Readers

  • Electrical Engineering
  • Microwave Engineering.
  • Missile Defense Systems.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems
  • Space
  • Space - Satellites