Synthesis and Properties of Bis(aniline, methyl)siloxy-octaphenylsilsesquioxane Modified Thermosetting Polyimide Oligomers
Abstract
High performance polyimides are utilized in a number of aerospace and microelectronic applications requiring thin films, wire coatings, adhesives, and matrices for fiber reinforced composites.1-3 In general, thermoplastic polyimides are produced from reactions between aromatic diamines and dianhydrides to form polyamic acids which in turn are thermally imidized to yield desired polymers.1 Due to inter-chain interactions and polymer chain rigidity, such materials are often intractable exhibiting viscosities prohibitive to the fabrication of components via melt processing. Limiting molecular weight through reactive endcapping promotes processability by improving solubility in solvents and reducing melt viscosity.3 This approach also facilitates the precise design of thermosetting oligomers to deliver target properties once they are cured to form polymer networks
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 19, 2011
- Accession Number
- ADA554635
Entities
People
- Andrew J. Guenthner
- Gregory R. Yandek
- Joseph M Mabry
- Timothy S. Haddad
Organizations
- Air Force Research Laboratory