Micromechanical Sensor for the Spectral Decomposition of Acoustic Signals

Abstract

This technical report is duplicative documentation of the approved doctorial thesis of one of the co-authors. The research was funded in part by the U.S. Army Aviation and Missile Research, Development, and Engineering Center (AMRDEC) for the development of micromechanical sensors under the Army Technology Objective (ATO) of Sensor, Warhead, and Fuzing Technology Integrated for Combined Effects (SWFTICE). Particular technical progress at AMRDEC within this report includes resonant array processing (Chapter 3), electrets integration with Microelectromechanical Systems (MEMS) with localized heater fabrication for wafer bonding and microcharging grids for in-situ charging using microcoronas (Chapter 4), and processing of MEMS transducers (Chapter 5).

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 2012
Accession Number
ADA556028

Entities

People

  • James C. Holt
  • Michael S. Kranz
  • Tracy D. Hudson

Organizations

  • United States Army Research, Development and Engineering Command

Tags

Communities of Interest

  • Advanced Electronics
  • Sensors
  • Weapons Technologies

DTIC Thesaurus Topics

  • Acoustic Waves
  • Ceramic Materials
  • Composite Materials
  • Dielectric Permittivity
  • Dielectrics
  • Electric Power
  • Electromagnetic Fields
  • Energy Harvesting
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Measurement
  • Microelectromechanical Systems
  • Resonant Frequency
  • Transducers

Readers

  • Integrated Circuit Design and Technology.
  • Materials Science and Engineering.
  • Military Science and Technology Research and Modernization.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems