Micro-Stirling Active Cooling Module (MS/ACM) for DoD Electronics Systems

Abstract

The Department of Defense has many systems that can benefit from the features of a cm-scale microrefrigerator. We are developing for DARPA a cm-scale Micro-Stirling Active Cooling Module (MS/ACM) microrefrigerator to benefit the DoD systems. Under a DARPA contract, we are designing, building, and demonstrating a breadboard MS/ACM.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 2012
Accession Number
ADA561797

Entities

People

  • Douglas S. Beck

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Compression
  • Contracts
  • Cooling
  • Cryocoolers
  • Cycles
  • Department Of Defense
  • Electronics
  • Gas Flow
  • Governments
  • Heat Energy
  • Heat Sinks
  • Heat Transmission
  • Isothermal Processes
  • Stirling Cycles
  • Thermal Resistance
  • Thermodynamic Processes
  • Thermodynamics

Fields of Study

  • Engineering

Readers

  • Energy Conservation and Renewable Energy Engineering.
  • Optical Fiber Sensing and Electromagnetic Propagation.

Technology Areas

  • Microelectronics