Activated States for Cross-slip at Screw Dislocation Intersections in Face-Centered Cubic Nickel and Copper via Atomistic Simulation

Abstract

We extend our recent simulation studies where a screw dislocation in face-centered cubic (fcc) Ni was found to spontaneously attain a low energy partially cross-slipped configuration upon intersecting a forest dislocation. Using atomistic (molecular statics) simulations with embedded atom potentials, we evaluated the activation barrier for a dislocation to transform from fully residing on the glide plane to fully residing on a cross-slip plane intersecting a forest dislocation in both Ni and Cu. The activation energies were obtained by determining equilibrium configurations (energies) when variable pure tensile or compressive stresses were applied along the [1 1 1] direction on the partially cross-slipped state. We show that the activation energy is a factor of 2-5 lower than that for cross-slip in isolation via the Escaig process. The cross-slip activation energies obtained at the intersection in Cu were in reasonable accord with the experimentally determined cross-slip activation energy for Cu. Further, the activation barrier for cross-slip at these intersections was shown to be linearly proportional to (d/b) [square root of [ln((square root of 3) d/b)]], as in the Escaig process, where d is the Shockley partial dislocation spacing and b is the Burgers vector of the screw dislocation. These results suggest that cross-slip should be preferentially observed at selected screw dislocation intersections in fcc materials.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2010
Accession Number
ADA566758

Entities

People

  • Christopher F. Woodward
  • Dennis M. Dimiduk
  • J. A. El-awady
  • M. D. Uchic
  • S.I. Rao
  • Triplicane A. Parthasarathy

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  • Air Force Research Laboratory

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Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Air Force
  • Air Force Research Laboratories
  • Calorific Value
  • Crystal Structure
  • Crystals
  • Energy
  • Heat Of Activation
  • Materials
  • Military Research
  • Molecular Dynamics
  • Simulations
  • Strain Hardening
  • Stresses
  • Tensile Stress
  • Three Dimensional
  • Two Dimensional

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  • Materials Science and Engineering.

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