Influence of Grain Structure and Doping on the Deformation and Fracture of Polycrystalline Silicon for MEMS/NEMS

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 2012
Accession Number
ADA567147

Entities

People

  • Ioannis Chasiotis

Organizations

  • University of Illinois Urbana–Champaign

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Boundaries
  • Crack Tips
  • Cracks
  • Electric Fields
  • Fabrication
  • Films
  • Grain Boundaries
  • Grain Size
  • Materials
  • Mechanical Properties
  • Mechanics
  • Microelectromechanical Systems
  • Polycrystals
  • Short Circuits
  • Stress Intensity Factors
  • Stresses
  • Thin Films