A New Twist on Scanning Thermal Microscopy

Abstract

The thermal bimorph is a very popular thermal sensing mechanism used in various applications from meat thermometers to uncooled infrared cameras. While thermal bimorphs have remained promising for scanning thermal microscopy, unfortunately the bending of the bimorph directly interferes with the bending associated with topographical information. We circumvent this issue by creating bimorphs that twist instead of bending and demonstrate the superior properties of this approach as compared to conventional scanning thermal microscopy.

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Document Details

Document Type
Technical Report
Publication Date
Jan 25, 2012
Accession Number
ADA583161

Entities

People

  • Dhaval D. Kulkarni
  • Hao Jiang
  • Michael E. McConney
  • Timothy J. Bunning
  • Vladimir V. Tsukruk

Organizations

  • Air Force Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Cell Physiological Processes
  • Chemical Vapor Deposition
  • Deflection
  • Electronic Equipment
  • Electronics
  • Fabrication
  • Geometry
  • Heat Energy
  • Imaging Techniques
  • Laser Spots
  • Materials
  • Materials Science
  • Microscopy
  • Photodetectors
  • Thermal Conductivity
  • Thermal Expansion
  • Thermal Properties

Fields of Study

  • Engineering

Readers

  • Forest Ecology
  • Image Processing and Computer Vision.
  • Thermal Physics or Thermal Science.