Toward a Micro-Scale Acoustic Direction-Finding Sensor with Integrated Electronic Readout

Abstract

Several advances are made toward a microelectromechanical (MEMS) acoustic direction-finding sensor based on the Ormia ochracea fly's ear. First, linear elastic stiffness models are presented and then validated by using a nanoindenter to measure the sensor s stiffness directly. The measured stiffness is highly linear, and the resonant frequencies are correctly predicted by the models presented. Additional nanoindenter results suggest that the sensor can be exposed to at least 162 decibel sound pressure level with no loss of function. Next, an improved capacitive readout system using branched comb fingers is presented. This design is shown to double electrical sensitivity to motion. Finally, it is shown that residual stress-induced curvature in the sensors greatly reduces their sensitivity by effectively shrinking the readout capacitors. A simple model of this curvature is presented and then verified by measurements. This model offers an extremely straightforward means of predicting curvature in similarly fabricated structures. It is also shown that perforations in the sensor s structure have no effect on curvature. The results presented here provide several essential tools for the continued development of the MEMS acoustic direction-finding sensor.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 2013
Accession Number
ADA583506

Entities

People

  • Richard H. Downey

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Sensors

DTIC Thesaurus Topics

  • Acoustic Signals
  • Brain Injuries
  • Direction Finding
  • Failure Mode And Effect Analysis
  • Geometry
  • Integrated Circuits
  • Measurement
  • Mechanical Properties
  • Mechanical Working
  • Mechanics
  • Microelectromechanical Systems
  • Modulus Of Elasticity
  • Resonant Frequency
  • Shear Modulus
  • Structural Components
  • Two Dimensional
  • Voltage

Readers

  • Integrated Circuit Design and Technology.
  • Materials Science (Mechanical Engineering).
  • Structural Dynamics.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems