A Review of Boiling Heat Transfer Processes at High Heat Flux

Abstract

This report summarizes an extensive background review of heat transfer processes, including boiling, that are encountered in the cooling of high enthalpy arc heater components. The objectives of this report are, (1) to review the different processes encountered in backside wall cooling and identify those processes that are desirable for effective cooling of high enthalpy arc heater components, (2) to identify those parameters which affect the cooling processes of interest and the trend of cooling performance when the parameters are individually varied, and (3) to present a summary of applicable theoretical, analytical, and experimental work in surface cooling performed in the past 50 years. A significant number of parameters are found to affect the cooling processes of interest, and, although a large number of correlations exists for boiling heat transfer, considerable inaccuracy is encountered in the prediction of pertinent parameters, particularly at elevated heat loads.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1991
Accession Number
ADA584968

Entities

People

  • G. R. Beitel

Tags

Communities of Interest

  • Cyber
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Air Force
  • Boundary Layer
  • Computational Fluid Dynamics
  • Convection
  • Energy
  • Energy Transfer
  • Film Boiling
  • Fluid Dynamics
  • Fluid Mechanics
  • Heat Capacity
  • Heat Energy
  • Heat Flux
  • Heat Transfer
  • Heat Transfer Coefficients
  • Latent Heat
  • Measurement
  • Thermal Conductivity

Readers

  • Combustion and Flow Dynamics.
  • Computational Modeling and Simulation
  • Systems Analysis and Design