Predicting Deformation and Strain Behavior in Circuit Board Bend Testing

Abstract

This report presents mathematical and finite element (FE) models that were used to predict the deformation and strain levels of a circuit board under a variety of four-point monotonic bend test configurations. The derivations of the mathematical models for deformation and strain are examined, and an equation modeling the strain rate of the board as it is bending is presented. The two and three-dimensional (2-D and 3-D) FE models are discussed and validated and the differences in deformation and strain levels between the models are accounted for. A convergence study was conducted to determine the optimal number of elements to use in these models and the results are also presented. In addition, key trends in the computed deformation and strain data across various test configurations are identified.

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Document Details

Document Type
Technical Report
Publication Date
May 01, 2012
Accession Number
ADA590805

Entities

People

  • Ronen Aniti

Organizations

  • George Washington University

Tags

Communities of Interest

  • Weapons Technologies

DTIC Thesaurus Topics

  • Circuit Boards
  • Circuits
  • Convergence
  • Curvature
  • Engineering
  • Equations
  • Flexural Properties
  • Geometry
  • Materials
  • Military Research
  • Modulus Of Elasticity
  • Printed Circuits
  • Shear Modulus
  • Strain Rate
  • Test Methods
  • Three Dimensional
  • Two Dimensional

Readers

  • Finite Element Method (FEM) for solving Partial Differential Equations (PDEs)
  • Mechanical Engineering/Mechanics of Materials.